TP Series Through-Hole Plating Equipment
DCT hole metallization equipment, use carbon film hole metallization process, through the most simple and reliable steps such as oil removal, washing, black hole, copper plating to achieve PCB reliable interlayer conduction.
Features
Ensure more uniform plating
Revertive impulse power supply
Design makes operation easily
Equipped with cycle filtration
Tank for OSP process
Product parameters
Technical data | TP300B | TP300/TP300P | TP400/TP400D | TP600D |
Max. board size | 230mm x 305mm | 230mm x 305mm | 400mm x 300mm | 600mm x 600mm |
Min. aperture | 0.3mm | 0.2 / 0.15mm | 0.2mm | 0.2mm |
Activaton liquid | Carbon black colloids | |||
Electric power type | DC | DC/ Revertive impulse current | DC | DC |
Cathode swing | None | Yes,adjustable speed | Yes,fix speed | Yes,fix speed |
Anode form | Arc | Arc | Plate | Plate |
Air agitation | None | Yes | Yes | Yes |
Circle filtration | None | Yes | Yes | Yes |
Water washing | Yes | Yes | Yes | Yes |
Number of plating tank | 1 | 1 | 1 / 2 | 4 |
Power supply | 220VAC/50Hz | 220VAC/50Hz | 220VAC/50Hz | 220VAC/50Hz |
Power consume | 1kW | 1.6kW | 2kW / 2.2kW | 5kW |
Dimension (W x H x D) | 1,000mm x 600mm×470mm | 1,000mm x 600mm x 470mm | 1,738mm x 826mm x 1,170mm | 2,000mm x 1,100mm x 1,300mm |
Weight | 32kg | 36kg | 250 / 280kg | 900kg |
